——逆向分析报告
三星GalaxyS7选择了最好的CMOS图像传感器技术
三星GalaxyS7集成了Sony新款CMOS图像传感器:IMX260,其采用全像素双核(full‘DualPixel’)相位检测自动对焦、采用深沟槽隔离(DTI)和铜-铜混合键合技术。
全像素双核是指图像传感器上每个像素都拥有两个光电二极管,而这两个光电二极管会分别接收光线并获取2个信号,之后即可进行相差检测自动对焦,而成像时会拼合2个光电二极管积蓄的电荷作为1个像素进行读取。简单理解就是在一个像素内对焦和成像同时进行,既保持了画质又增加了对焦速度。
IMX260虽然只有1200万像素,但是像素尺寸更大(1.4微米)、光圈更大(F/1.7)、自动对焦更好,尤其在低光环境下拍照简直堪称完美。该摄像头模组的红外滤波采用的塑料片,不像iPhone6SPlus采用的是比较常见的蓝色玻璃滤光片。
三星GalaxyS7后置摄像头模组
三星GalaxyS7后置摄像头模组尺寸为12x12x5.3mm,集成了6-elements透镜模组和音圈马达(VCM)自动对焦执行器。该摄像头模组还有一颗专门用来调焦的二轴陀螺仪(来自意法半导体),以及光学防抖驱动程序(来自瑞萨)和串行闪存(来自华邦)。
IMX260图像传感器剖面图
本报告介绍对三星GalaxyS7后置摄像头模组和IMX260图像传感器进行详细的结构、工艺、材料和成本分析,并与iPhone6SPlus后置摄像头模组进行对比。
报告目录:
Overview and Introduction
Supply Chain and Company Profile
Samsung Galaxy S7 Teardown
Physical Analysis? Camera module view and dimensions? Camera module disassembly? STMicroelectronics L2G2IS gyroscope? Renesas OIS driver? Winbond Serial flash memory? Cross-Section Camera Module (including Housing, AFA/OIS, IR Filter, FPC)? Comparison with Samsung Galaxy S6 and iPhone 6S Structure? CMOS Image Sensor- View and dimensions- Pads, wire bonding and Tungsten grid- CIS pixels- Logic circuit (main blocks, transistors, SRAM, ROM)? CMOS Image Sensor Cross-Section- Overview- Pixel Array circuit- Logic circuit- Pad trench- Cu-Cu hybrid bonding? Comparison with iPhone 6S and 6S Plus CMOS Image Sensor
CIS Manufacturing Process Flow? Global Overview? Logic Circuit Front-End Process? Pixel Array Circuit Front-End Process? BSI, Cu-Cu Hybrid Bonding and Microlens Processes? CIS Wafer Fabrication Unit
Cost Analysis? Cost Analysis Synthesis? The Main Steps Used in the Economic Analysis? Yield Hypotheses? CMOS Image Sensor Cost- Logic circuit front-end cost- Pixel Array front-end cost- BSI and Cu-Cu hybrid bonding front-end cost- Color filter and Microlens frontend cost- Total front-end cost- Back-end: tests and dicing- CIS wafer and die cost? Camera Module Assembly Cost- Lens module cost- AFA/OIS cost- Final assembly cost? Camera Module Cost
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